Balancing thermal conductivity, dielectric, and tribological properties in polyamide 1010 with 2D nanomaterials

Página do item simplificado
dc.contributor.authorPinto G.M.
dc.contributor.authorStaffa L.
dc.contributor.authorHelal E.
dc.contributor.authorHahn C.
dc.contributor.authorVieira L.
dc.contributor.authorRibeiro H.
dc.contributor.authorDavid E.
dc.contributor.authorDemarquette N.R.
dc.contributor.authorFechine G.J.M.
dc.date.accessioned2024-10-01T06:11:47Z
dc.date.available2024-10-01T06:11:47Z
dc.date.issued2024
dc.description.abstract© 2024 Wiley Periodicals LLC.Low electrical conductivity and high heat dissipation are crucial for electronic packaging materials. Additionally, friction is critical for the lifespan and energy efficiency of components. To address these requirements, polymer nanocomposites based on bio-based polyamide 1010 and ultra-low contents of 2D nanomaterials were produced by melt-blending. Graphene oxide, hexagonal boron nitride, and molybdenum disulfide were selected for their two-dimensional structure and electrical insulation, providing high thermal conductivity while preserving the polymer's dielectric nature. Hybrid nanocomposites were also produced to explore potential synergistic effects. Results showed all compositions maintained the polymer's intrinsic dielectric properties. Although the friction coefficient increased slightly compared with neat polyamide, all nanocomposites remained within the low-friction range required for low-friction materials. Thermal conductivity improved by 5%–10% compared with unfilled polyamide, with hybrid systems performing slightly better, indicating a minor synergistic effect. Despite these enhancements being modest compared with the literature, achieving high thermal conductivity usually requires over 20 wt% of nanofiller, which is detrimental to mechanical performance. In this study, at most 0.5 wt% was used, with composites being obtained directly through melt-blending. This highlights their potential as low-content additives for thermal interface materials without compromising other essential properties.
dc.identifier.doi10.1002/app.56321
dc.identifier.issnNone
dc.identifier.urihttps://dspace.mackenzie.br/handle/10899/39477
dc.relation.ispartofJournal of Applied Polymer Science
dc.rightsAcesso Restrito
dc.subject.otherlanguage2D nanomaterials
dc.subject.otherlanguagedielectric properties
dc.subject.otherlanguagefriction
dc.subject.otherlanguagepolymer nanocomposites
dc.subject.otherlanguagethermal conductivity
dc.titleBalancing thermal conductivity, dielectric, and tribological properties in polyamide 1010 with 2D nanomaterials
dc.typeArtigo
local.scopus.citations0
local.scopus.eid2-s2.0-85204630136
local.scopus.subject2D nanomaterial
local.scopus.subjectDielectrics property
local.scopus.subjectHigh thermal conductivity
local.scopus.subjectLow friction
local.scopus.subjectMelt blending
local.scopus.subjectPolyamide-1010
local.scopus.subjectPolymer nanocomposite
local.scopus.subjectPolymer-nanocomposite
local.scopus.subjectSynergistic effect
local.scopus.subjectThermal
local.scopus.updated2025-04-01
local.scopus.urlhttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85204630136&origin=inward
Arquivos
Coleções
Artigos de periódico