Mechanical, thermal and electrical properties of polymer (Ethylene terephthalate—PET) filled with carbon black

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dc.contributor.authorMesquita A.S.
dc.contributor.authorde Andrade e Silva L.G.
dc.contributor.authorde Miranda L.F.
dc.date.accessioned2024-03-12T23:59:52Z
dc.date.available2024-03-12T23:59:52Z
dc.date.issued2018
dc.description.abstract© The Minerals, Metals & Materials Society 2018.This work seeks to understand if PET compounds with carbon black can be uses to replace polypropylene and polystyrene for anti-static packaging materials. PET compounds were fabricated containing 10.0; 11.0; 12.0 and 15.0 weight % of carbon black with a particle size 325 mesh. We determined the thermomechanical properties (Dynamic Mechanical Analysis—DMA, Tensile Properties, Fracture Toughness, and Hardness) and Electrical properties of the compounds. In conclusion the results show the compound based on PET filled with 15.0% carbon black might be used in the handling, transportation and storage of electronic components because their mechanical properties, thermal and resistivity are satisfactory for this purpose.
dc.description.firstpage605
dc.description.lastpage614
dc.description.volumePart F8
dc.identifier.doi10.1007/978-3-319-72484-3_64
dc.identifier.issn2367-1696
dc.identifier.urihttps://dspace.mackenzie.br/handle/10899/35643
dc.relation.ispartofMinerals, Metals and Materials Series
dc.rightsAcesso Restrito
dc.subject.otherlanguageCarbon black
dc.subject.otherlanguageConductivity
dc.subject.otherlanguageEthylene terephthalate
dc.titleMechanical, thermal and electrical properties of polymer (Ethylene terephthalate—PET) filled with carbon black
dc.typeArtigo de evento
local.scopus.citations6
local.scopus.eid2-s2.0-85042450043
local.scopus.subjectAnti-static
local.scopus.subjectElectronic component
local.scopus.subjectPET compounds
local.scopus.subjectTerephthalate
local.scopus.subjectThermal and electrical properties
local.scopus.subjectThermomechanical properties
local.scopus.updated2024-05-01
local.scopus.urlhttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85042450043&origin=inward
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