Plasma-Assisted Nanofabrication: The Potential and Challenges in Atomic Layer Deposition and Etching

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dc.contributor.authorChiappim W.
dc.contributor.authorNeto B.B.
dc.contributor.authorShiotani M.
dc.contributor.authorKarnopp J.
dc.contributor.authorGoncalves L.
dc.contributor.authorChaves J.P.
dc.contributor.authorSobrinho A.D.S.
dc.contributor.authorLeitao J.P.
dc.contributor.authorFraga M.
dc.contributor.authorPessoa R.
dc.date.accessioned2024-03-12T19:13:54Z
dc.date.available2024-03-12T19:13:54Z
dc.date.issued2022
dc.description.abstract© 2022 by the authors.The growing need for increasingly miniaturized devices has placed high importance and demands on nanofabrication technologies with high-quality, low temperatures, and low-cost techniques. In the past few years, the development and recent advances in atomic layer deposition (ALD) processes boosted interest in their use in advanced electronic and nano/microelectromechanical systems (NEMS/MEMS) device manufacturing. In this context, non-thermal plasma (NTP) technology has been highlighted because it allowed the ALD technique to expand its process window and the fabrication of several nanomaterials at reduced temperatures, allowing thermosensitive substrates to be covered with good formability and uniformity. In this review article, we comprehensively describe how the NTP changed the ALD universe and expanded it in device fabrication for different applications. We also present an overview of the efforts and developed strategies to gather the NTP and ALD technologies with the consecutive formation of plasma-assisted ALD (PA-ALD) technique, which has been successfully applied in nanofabrication and surface modification. The advantages and limitations currently faced by this technique are presented and discussed. We conclude this review by showing the atomic layer etching (ALE) technique, another development of NTP and ALD junction that has gained more and more attention by allowing significant advancements in plasma-assisted nanofabrication.
dc.description.issuenumber19
dc.description.volume12
dc.identifier.doi10.3390/nano12193497
dc.identifier.issn2079-4991
dc.identifier.urihttps://dspace.mackenzie.br/handle/10899/34305
dc.relation.ispartofNanomaterials
dc.rightsAcesso Aberto
dc.subject.otherlanguageALD
dc.subject.otherlanguagenon-thermal plasma
dc.subject.otherlanguageplasma-assisted atomic layer deposition
dc.subject.otherlanguageplasma-atomic layer etching
dc.subject.otherlanguageplasma-enhanced atomic layer deposition
dc.subject.otherlanguageradical-enhanced atomic layer deposition
dc.subject.otherlanguagethin-film
dc.titlePlasma-Assisted Nanofabrication: The Potential and Challenges in Atomic Layer Deposition and Etching
dc.typeArtigo de revisão
local.scopus.citations7
local.scopus.eid2-s2.0-85139960372
local.scopus.updated2024-12-01
local.scopus.urlhttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85139960372&origin=inward
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